Custom FOUNDRY Service
Custom FOUNDRY Service
The 5 and 6-inch manufacturing lines operated by Phenitec are the backbone of our integrated wafer foundry business, covering from epitaxial growth, wafer processing and to testing in Japan.
Utilizing the technological capability and responsiveness, we have developed, since our founding, the products and services that altogether contribute to the growth of our customers.
Supported Devices
We provide our customers with excellent products through our "Design Transfer + Process Transfer" service building wafer process based on mask data and process information provided by customers or our "Design Transfer" service where we handle from process design to production for devices designed by customers. The entire wafer process from epitaxial growth to wafer inspection and testing is capable in-house within Phenitec. We do not own assembly process but do have an outsourcing partner for die sawing. We can also accommodate partial processing. Please contact our sales staff for details.
Production by consigning and Process capability
| Product | Specification | Key Equipment |
| MOSFET | Planer Trench Split Gate |
Stepper W-Plug CMP Deep RIE |
| IGBT | Planer/Non Punch Through Planer/Punch Through Trench/Field Stop |
TAIKO Laser Anneal High Energy Impact（2-3MeV） |
| CMOS | 0.35μm/6V/2Poly-3Metal 0.6μm/6V/2Poly-2Metal 5V-42V/1Poly-3Metal |
WSi W-Plug CMP |
| Diode | Fast Recovery Diode Photo Diode Ze Diode Shottky Barrier Diode Switching Diode |
Heavy Metal Diffusion Metal Sputtering |
| Bipolar Transistor | NPN Transistor:BVCEO（〜800V） PNP Transistor:BVCEO（〜600V） |
|
| TVS | Single/Anode Common/Bi-Direction Bi-Direction ESD≧8kV Uni-Direction ESD≧8kV〜15kV |
|
| Bipolar IC | BVCEO 40V | |
| MEMS | Partial Processing Only | Deep RIE |
| Other | Wafer Inspection and Testing Die sawing |
Laser-Trimming We have multiple fab partners. |
Compound Semiconductors
Compound semiconductor has excellent material properties and increasingly being used in PFC circuit and inverter for data center, industrial instrument, EV, railroad vehicle and other applications. Phenitec is involved in this field gaining increasing attention as the world strives to achieve a decarbonized society. Utilizing know-how we have built up from the power device development over many years, we are promoting R&D on power semiconductors using silicon carbide (SiC) and gallium oxide (Ga2O3) for mass production. We have experienced in partial processing for gallium nitride (GaN). For SiC, we have started sample shipment of Schottky device and are proceeding with MOSFET development.
| Compound name | Device and Specifications | Related Major Equipment |
| SiC | MOSFET SBD |
HT Impla Activation anneal（post implant anneal） RIE RTA |
| Ga2O3 | SBD | |
| GaN |
Production System
Production site
We have two fabs in Okayama and one in Kagoshima. Each fab handles different devices. For details, refer to "Facility information."
Certifications
Quality standards: ISO9001 in 2015, IATF16949 in 2016; Environmental / Occupational Safety and Health Standards: ISO14001 in 2015, ISO45001 in 2018. For details, refer to "Approach to Quality, Environment, and Safety and health."
